ts820-b/t ? november 1998 - ed: 6a sensitive scr symbol parameter value unit i t(rms) rms on-state current (180 conductionangle) tc= 110 c8 a i t(av) average on-state current (180 conductionangle) tc= 110 c5 a i tsm non repetitive surge peak on-state current (t j initial = 25 c) tp = 8.3ms tp = 10ms 73 70 a i 2 ti 2 t value for fusing tp = 10ms 24 a 2 s di/dt critical rate of rise of on-state current i g =10ma di g /dt = 0.1 a/ m s. 100 a/ m s t stg t j storage junction temperature range operating junction temperature range - 40 to + 150 - 40 to + 125 c tl maximum temperature for soldering during 10s 260 c absolute ratings (limiting values) dpak (plastic) ts820-b i t(rms) =8a v drm /v rrm = 400, 600v, 700v i gt < 200 m a smd package features symbol parameter ts820- unit 400b/t 600b/t 700b/t v drm repetitive peak off-state voltage 400 600 700 v v rrm t j = 125 cr gk = 220 w the ts820-b/t series of scr use a high perform- ance topglass pnpn technology. the parts are intended for general purpose appli- cations using surface mount or through hole tech- nology. description k a g a to-220ab (plastic) TS820-T a a g k 1/6
p g (av) = 0.2 w p gm = 3 w (tp = 20 m s) i gm = 1.2 a (tp = 20 m s) gate characteristics (maximum values) symbol parameter value unit rth(j-a) junction to ambient (s=0.5cm 2 ) dpak 70 c/w to-220ab 60 rth(j-c) junction to case for dc dpak / to-220ab 2.0 c/w thermal resistances symbol test conditions type value unit i gt v d =12v (dc) r l =140 w tj= 25 c max 200 m a v gt v d =12v (dc) r l =140 w tj= 25 c max 0.8 v v gd v d =v drm r l =3.3k w r gk = 220 w tj= 125 c min 0.1 v v rg i rg =10 m a tj= 25 c min 8 v i h i t = 50ma r gk =1k w tj= 25 c max 5 ma v tm i tm = 16a tp= 380 m s tj= 25 c max 1.6 v i drm v d =v drm r gk = 220 w tj= 25 c max 5 m a i rrm v r =v rrm r gk = 220 w tj= 125 c max 1 ma dv/dt v d =67%v drm r gk = 220 w tj= 125 c min 5 v/ m s electrical characteristics ordering information ts 8 20 - 600 b/t sensitive scr current package: b: dpak t: to-220 voltage sensitivity add o-tro suffix for tape & reel shipment ts820-b/t 2/6
01234567 0 2 4 6 8 10 it(av)(a) p(w) 360 a d.c. a = 180 a = 120 a =90 a =60 a =30 fig. 1: maximum average power dissipation ver- sus average on-state current. 0 25 50 75 100 125 0 2 4 6 8 10 tamb( c) p(w) tcase ( c) 125 110 120 115 a = 180 rth=0 c/w rth=5 c/w rth=15 c/w rth=10 c/w rth=37 c/w fig. 2: correlation between maximum average powerdissipation and maximum allowable tempera- tures (tamb and tcase) for different thermal resis- tances heatsink + contact. 0 25 50 75 100 125 0 2 4 6 8 10 tcase( c) it(av)(a) dc a =180 fig. 3-1: average and d.c. on-statecurrent versus case temperature (to-220ab). 1e-3 1e-2 1e-1 1e+0 0.1 0.2 0.5 1.0 tp(s) k=[zth(j-c)/rth(j-c)] fig. 4-1: relative variation of thermal impedance junction to case versus pulse duration. 0 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 tamb( c) it(av)(a) a =180 dc fig. 3-2: averageand d.c. on-state current versus ambient temperature (device mounted on fr4 with recommended pad layout) (dpak) . 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 0.01 0.10 1.00 tp(s) k=[zth(j-a)/rth(j-a)] fig. 4-5: relative variation of thermal impedance junction to ambient versus pulse duration (recom- mended pad layout, fr4 pc board) (dpak). ts820-b/t 3/6
12 510 10 20 50 100 300 tp(ms) itsm(a),i t(a s) tj initial=25 c itsm i t fig. 7: non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and cor- responding value of i 2 t. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.1 1.0 10.0 100.0 vtm(v) itm(a) tj max.: vto=0.85v rd=46m w tj=tj max. tj=25 c fig. 8: on-statecharacteristics (maximum values). 02468101214161820 0 20 40 60 80 100 s(cm ) rth(j-a) ( c/w) fig. 9: thermal resistance junction to ambient ver- sus copper surface under tab (epoxyprinted circuit board fr4, copper thickness: 35 m m) (dpak). -40 -20 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 tj( c) igt,ih [tj] / igt,ih [tj=25 c] igt ih fig. 5: relative variation of gate trigger current and holding current versus junction temperature. 1 10 100 1000 0 10 20 30 40 50 60 70 80 number of cycles itsm(a) tj initial=25 c f=50hz fig. 6: non repetitive surge peak on-state current versus number of cycles. 0 40 80 120 160 200 240 280 320 360 t( c) 250 200 150 100 50 0 epoxy fr4 board metal-backed board 245 c 215 c t (s) fig. 10: typical reflow soldering heat profile, either for mounting on fr4 or metal-backed boards. ts820-b/t 4/6
package mechanical data dpak (plastic) h l4 g b l2 e b2 d a1 c a c2 0.60 min. v2 a2 ref. dimensions millimeters inches min. typ. max min. typ. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 0.031 l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 6.7 6.7 6.7 3 1.6 1.6 2.3 2.3 foot print dimensions (in millimeters) ts820-b/t 5/6
package mechanical data to-220ab(plastic) a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1998 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - mexico - morocco - the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. http://www.st.com type marking package weight base qty delivery mode ts820-b ts820x00b dpak 0.3 g. 75 tube 2500 tape and reel TS820-T ts820x00t to-220ab 2 g. 50 tube ts820-b/t 6/6
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